We provide tests on packages and interconnects (component back-end), in order to evaluate various issues :

Control of the quality of microelectronic assembly operations : bonding (wire pull, ball shear), die attach (die shear)
Aging effect of mechanical resistance

We perform these tests on semiconductor devices back-end: wedge bonding, BGA, ball bonding, die attach.

Mechanical strength

Bonding :
Bond strength / Wire bond shear test : MIL-STD-883 Method 2011.9 ; IEC 60749-22 ; JESD22-B116B

Die attach on substrate :
Substrate Attach Strength : MIL-STD-883 Method 2027.2
Die shear strength : MIL-STD-883 Method 2019.9

Package hermeticity

Fine / gross leak :
MIL-STD 883 Method 1014.15 ; IEC 60749-8

Microcavities / very fine leaks :
Membrane deflection or N2O penetrant (SEMI MS8-0309)

Internal package integrity

PIND test : MIL-STD 750F Method 2052

Applicable standards

IEC 60749 Semiconductor devices - Mechanical and climatic test Methods

JEDEC JESD22 Solid State Device Environmental Testing

MIL-STD 750F Test methods for semiconductor devices (version F, 11/16)

MIL-STD-883K Test Method standard for microcircuits (version K, 04/16)