Under ESA authority, we assess the compliance of your space-dedicated boards with the criteria of ECSS-Q-ST-70-38C. This standard defines high requirements on each part constituting the electronic assembly: circuit board, solder joints, components, varnish.

We perform these controls of electronic boards dedicated to long-life embedded space applications (science, telecom, defence). The protocol of ECSS-Q-ST-70-38C is established in 3 steps :

External visual control

X-ray radiography (BGA, CCGA, LGA, D2PAK...)

Optical inspection on microsection

Applicable issue : ECSS-Q-ST-70-38C, Revision 1 Corrigendum 1 (September 2018)

Visual inspection

X-ray Radiography

Overall aspect (varnish, endings, PCB)

Void ratio & crack detection

Microsection & optical microscopy

Solder joint thickness, stand-off and homogeneity

Voids + bad alignment (endings / footprint)

Crack in the solder joint

PCB : no delamination / crack

Component : no microcrack

Complementary ELEMCA services

Bare PCB : ECSS-Q-ST-70-60C

Industrial applications : IPC-A-610

New Space : mixed criteria (IPC-A-610 visual inspections + ECSS microsections )

Discover all ELEMCA services :

NDT & metrology Defect non-destructive localization Physical & chemical analyses Thermomechanical characterization Microstructural analyses IPC-A-610 inspections Digital simulation Environmental tests Back-end tests