Under ESA authority, we assess the compliance of your space-dedicated boards with the criteria of ECSS-Q-ST-70-38C. This standard defines high requirements on each part constituting the electronic assembly: circuit board, solder joints, components, varnish.
We perform these controls of electronic boards dedicated to long-life embedded space applications (science, telecom, defence). The protocol of ECSS-Q-ST-70-38C is established in 3 steps :
X-ray radiography (BGA, CCGA, LGA, D2PAK...)
Applicable issue : ECSS-Q-ST-70-38C, Revision 1 Corrigendum 1 (September 2018)
Visual inspection
X-ray Radiography
Overall aspect (varnish, endings, PCB)
Void ratio & crack detection
Microsection & optical microscopy
Solder joint thickness, stand-off and homogeneity
Voids + bad alignment (endings / footprint)
Crack in the solder joint
PCB : no delamination / crack
Component : no microcrack