We control and assess the quality of your electronic boards dedicated to demanding markets. The acceptance criteria and applicable standards depend on the aimed application:

  • ECSS-Q-ST-70-08C/38C: legacy space (sciences, observation, defense, telecom)
  • IPC-A-610, classe 3: new space (IoT constellations, aeronautics, railway, naval, energy

ELEMCA is recognized as Category A laboratory and recommended by ESA for these ECSS-compliance verifications. PDF list "ESA recommended microsectioning facilities"

Our inspections and controls rely on every constitutive elements of your electronic assemblies: solder joints, printed circuit, components, connectors, varnish.

The protocol of IPC standard is based on 2 steps, as ECSS has an extra step (destructive: optical microscopy on microsection):

IPC-A-610G (revision G, October 2017)

External visual control
X-ray radiography
[option] Optical inspection on microsection

ECSS-Q-ST-70-08C/38C (revision 1 corrigendum 1, September 2018)

External visual control
X-ray radiography (composants BGA, CCGA, LGA, D2PAK...)
Optical inspection on microsection

External visual inspection (IPC + ECSS)

Compliance vs IPC criteria

Wetting issue

Crack in the solder joint

Bad alignment + cleanliness issue

X-ray Radiography (IPC + ECSS)

2D void ratio

Filling of Through-Hole Vias

Microsection + optical inspection (ECSS or IPC option)

Compliance vs ECSS criteria

Solder joint thickness, stand-off and homogeneity

Insufficient heel fillet height

Crack in the solder joint

PCB : no delamination / crack

Component: no micro-crack

Complementary ELEMCA services

Bare circuit board : IPC-A-600

Connectors : IPC-A-620

Do you want a detailed presentation of our Lab services or consult us on a specific need ?

Contact us