We control and assess the quality of your electronic boards dedicated to demanding markets. The acceptance criteria and applicable standards depend on the aimed application:
- ECSS-Q-ST-70-08C/38C: legacy space (sciences, observation, defense, telecom)
- IPC-A-610, classe 3: new space (IoT constellations, aeronautics, railway, naval, energy
ELEMCA is recognized as Category A laboratory and recommended by ESA for these ECSS-compliance verifications. PDF list "ESA recommended microsectioning facilities"
Our inspections and controls rely on every constitutive elements of your electronic assemblies: solder joints, printed circuit, components, connectors, varnish.
The protocol of IPC standard is based on 2 steps, as ECSS has an extra step (destructive: optical microscopy on microsection):
IPC-A-610G (revision G, October 2017)
External visual control
X-ray radiography
[option] Optical inspection on microsection
ECSS-Q-ST-70-08C/38C (revision 1 corrigendum 1, September 2018)
External visual control
X-ray radiography
(composants BGA, CCGA, LGA, D2PAK...)
Optical inspection on microsection
External visual inspection (IPC + ECSS)
Compliance vs IPC criteria
Wetting issue
Crack in the solder joint
Bad alignment + cleanliness issue
X-ray Radiography (IPC + ECSS)
2D void ratio
Filling of Through-Hole Vias
Microsection + optical inspection (ECSS or IPC option)
Compliance vs ECSS criteria
Solder joint thickness, stand-off and homogeneity
Insufficient heel fillet height
Crack in the solder joint
PCB : no delamination / crack
Component: no micro-crack
Complementary ELEMCA services
Bare circuit board : IPC-A-600
Connectors : IPC-A-620
Do you want a detailed presentation of our Lab services or consult us on a specific need ?