Your job brings you face to face with major challenges:
💪 Validating the reliability of your components for applications in harsh environments
✅ Ensuring Process control of your production (front + back-end), whether in-house or outsourced, perform a DPA (Destructive Physical Analysis) of devices
🚨 Obtain a clear diagnosis following the appearance of failures (field return, production issue...)
Our technicians and engineers provide you with all their responsiveness and expertise to deal with these issues.
Discover ELEMCA's services to meet your needs at every stage of your MEMS & semiconductor development.
I WANT TO...
MAKE MY MICROELECTRONIC DESIGN CHOICE MORE RELIABLE
→ physical / digital assessment of technologies & materials
Simulate risk zones: heat dissipation or high mechanical stresses
Test the performances of components at package level or wafer level
Our studies are based on a mixed numerical and physical approach:
- Numerical simulation of thermal or mechanical behavior
- Characterization of component functional performance - on wafer or at package level
You put your design choices (chip core, packaging) to the test, to set them in stone or improve them.
CHECK THE CONFORMITY OF MY CHIPS AND PACKAGED COMPONENTS
→ Manufacturing quality (front-end + back-end), qualification
Inspect any critical structures : material composition & dimensions
Assess the quality of the die attach, of the wirebondings or of the BGA balls
Assess the reliability of my products towards harsh environnments
Our back-end tests (hermeticity, chip or bead shear, wire pull-out) and tests (thermal cycling, moist heat, thermal vacuum) are carried out in accordance with a wide range of standards (IEC, JEDEC, MIL-STD, SEMI or customer standards).
You can be sure of the high quality and conformity of your components.
UNDERSTAND THE ROOT CAUSE OF FAILURES
→physics of failure, failure mechanism identification
Identify the defect's electrical signature
Non-destructive failure localization
p>Access the defect and characterize it to explain the root cause
Our MEMS & Semiconductor specialists identify and explain the probable root cause and associated failure mechanisms in a detailed expert report.
You know the weak point of your product (design, assembly, integration, use), so you can find an effective corrective solution.