Your job brings you face to face with major challenges:
💪 Validating the reliability of your components for applications in harsh environments
✅ Ensuring Process control of your production (front + back-end), whether in-house or outsourced, perform a DPA (Destructive Physical Analysis) of devices
🚨 Obtain a clear diagnosis following the appearance of failures (field return, production issue...)

Our technicians and engineers provide you with all their responsiveness and expertise to deal with these issues.

Discover ELEMCA's services to meet your needs at every stage of your MEMS & semiconductor development.

I WANT TO...


MAKE MY MICROELECTRONIC DESIGN CHOICE MORE RELIABLE

→ physical / digital assessment of technologies & materials

Our studies are based on a mixed numerical and physical approach:
   - Numerical simulation of thermal or mechanical behavior
   - Characterization of component functional performance - on wafer or at package level

You put your design choices (chip core, packaging) to the test, to set them in stone or improve them.

CHECK THE CONFORMITY OF MY CHIPS AND PACKAGED COMPONENTS

→ Manufacturing quality (front-end + back-end), qualification

Our back-end tests (hermeticity, chip or bead shear, wire pull-out) and tests (thermal cycling, moist heat, thermal vacuum) are carried out in accordance with a wide range of standards (IEC, JEDEC, MIL-STD, SEMI or customer standards).

You can be sure of the high quality and conformity of your components.

UNDERSTAND THE ROOT CAUSE OF FAILURES

→physics of failure, failure mechanism identification

Our MEMS & Semiconductor specialists identify and explain the probable root cause and associated failure mechanisms in a detailed expert report.

You know the weak point of your product (design, assembly, integration, use), so you can find an effective corrective solution.