Our facilities include the CNES equipment shared with ELEMCA and our own means. These cumulated installations exceed 1000m2 and 50+ advanced equipment.

Out-sourcing (*) : we collaborate with locale or French partners, to assure overall project management of technical affairs requiring exclusive equipment.

NDT / Non Destructive Test & defect localization

X-ray radiography (2D) / computed tomography (3D) + laminography

LIT / Lock-in IR Thermography

PHEMOS, OBIRCH, IR confocal microscopy

CSAM / C-Scanning Acoustic Microscopy*

Sample preparation

FIB plasma Xenon, FIB Gallium

Acid, laser*, micro-drilling

Parallel or transverse polissing (bare die or in resin molding)

Saw cutting (cross-cut, diamond-wire)

Optical / electronical imaging


SEM+EDX: low vacuum, FEG + STEM, EBSD

Binoculars, optical microscopes

Elementary chemical analysis

EDX detectors (SEM-coupled)

X-ray fluorescence (XRF)


Metallurgical / microstructural analysis

EBSD detectors (SEM-coupled)

Revelation + optical inspection

Contamination / molecular analysis

IR spectroscopy (FT-IR)

Outgassing TML/CVCM/RML

Thermal characterization [-150°c ; +500°c]

Dilatometry / TMA [Max + 1 500°C]

DMA: viscoelasticity = f (T°)

DSC: Tg / Temperature of Glass transition

ATG: outgassing of volatile compound at ambient pressure

Material electrical characterization

Electrometer, pico-ammeter (σ, ρ)

Device electrical tests

LIA / Lock-In Amplifier (DC-200MHz)

Parametric analyzers (DC-1GHz)

Electronic package evaluation

Wire pull, ball shear, die shear

Hermeticity : fine & gross leak

Solderability : wetting balance*

Mechanical characterization

Nanoindentation test (Berkovich hardness) ; Vickers hardness

Universal testing machines [-80°C; + 250°C] + contact-less extensometer

Accelerated aging tests

Thermal vacuum [-180°C; +200°C / <10-5 mbar]

Climatic [+ 95°C / 95%HR]

Thermal cycling [-180°C ; + 300°C]

+ power supply [DC-1GHz]

Shocks* / vibrations*