Our facilities include the CNES equipment shared with ELEMCA and our own means. These cumulated installations exceed 1500m2 and 50+ advanced equipment: 2 X-Ray CT, 4 SEM-EDS, 3 FIB. All of them operated directly by our engineer and technician staff.
Key equipments ; New 2024 ; Out-sourcing (*) : subcontracted to our partners (Toulouse or France)
NDT / Non Destructive Test & defect localization
X-ray : 2D radiography, 3D computed tomography, laminography
LIT / Lock-in IR Thermography
PHEMOS, OBIRCH, IR confocal microscopy
CSAM / C-Scanning Acoustic Microscopy*
Sample preparation
FIB plasma Xenon, FIB Gallium
Acid, laser, micro-drilling
Parallel or transverse polissing (bare die or in resin molding)
Ionic cross-polisher
Saw cutting (cross-cut, diamond-wire)
Optical / electronical imaging & surface analysis
TEM*, STEM + EDS detector
SEM (modes : FEG, low vacuum, BSE, ASB) + EDS, EBSD detectors
Binoculars, optical microscopes
Optical profilometry (confocal, interferometry)
AFM - Atomic Force Microscopy
Elementary chemical analysis
EDX detectors (SEM-coupled)
X-ray fluorescence (XRF)
IR spectrometry (FT-IR)
Metallurgical / microstructural analysis
EBSD detector (SEM-coupled)
Revelation + optical inspection
Thermal characterization [-150°C ; +500°C]
Dilatometry / TMA [Max + 950°C]
DMA: viscoelasticity = f (T°)
DSC: Tg / Temperature of Glass transition
ATG: degradation temperature of polymers
Outgassing TML/CVCM/RML
Material electrical characterization
Electrometer, pico-ammeter (σ, ρ)
Electrical tests at wafer / package / board-levels
Component tester : passive, active, power
LIA / Lock-In Amplifier (DC-200MHz)
Parametric analyzers (DC-1GHz)
Data acquisition equipment
ESD testing (HBM, MM)
Electronic package evaluation
Wire pull, ball shear, die shear
Hermeticity : fine & gross leak
Solderability : wetting balance*
Mechanical characterization
Nanoindentation test (Berkovich hardness) ; Vickers hardness
Universal testing machines [-80°C; + 250°C] + contact-less extensometer
Accelerated aging tests
Thermal vacuum [-180°C; +200°C ] / partial pressure down to vaccum <10-5 mbar]
Climatic [+ 95°C / 95%HR]
Thermal cycling [-180°C ; + 300°C], Thermal shocks [-80°C ; +220°C]
+ power supply [DC-1GHz]
Shocks* / vibrations*