We use our X-ray radiography and IR thermal imaging equipment to answer your various needs :
Failure analysis on electronic devices: detection of physical (X-ray CT) or thermal anomalies (LIT). After a preliminary electrical test (failure mode), the defect thus spotted will then be inspected by optical or electronical (SEM) microscopy, generally after microsection or package opening
Reverse engineering: localization of the key internal parts, inside a SiP or a molded device, before technological analysis
IPC-A-610 compliance : through-hole filling, 2D void ratio
Thermal cartography (steady mode), in comparison with a digital simulation
Measurements of thermal resistance (Rth), after package opening
We lead these non-destructive analyses on electronic components (MEMS, sensors, passive, discrete, electromechanics), printed circuit boards (bare, assembled, molded) and connectors.
Lock-in IR Thermography / LIT
IR thermal mapping : static mode (PCBA overall heatness) ; dynamic "LIT" mode (tiny hot spots localization)
Detection of leakage current (LIT)
Accurate temperature measurement (LIT)
Do you want a detailed presentation of our Lab services or consult us on a specific need ?