We use our X-ray radiography and IR thermal imaging equipment to answer your various needs :



We lead these non-destructive analyses on electronic components (MEMS, sensors, passive, discrete, electromechanics), printed circuit boards (bare, assembled, molded) and connectors.


X-ray Computed tomography (RX 2D/3D)

Crack detection (X-ray 2D radiography)

Volume reconstruction (computed tomography)

Virtual slicing (CT)

Color-mapping (CT)




Lock-in IR Thermography / LIT

LIT static modeLIT dynamic mode

IR thermal mapping : static mode (PCBA overall heatness) ; dynamic "LIT" mode (tiny hot spots localization)

Detection of leakage current (LIT)

Accurate temperature measurement (LIT)