In addition to our laboratory services, we offer finite element simulation (FEM) services. These cover the thermal, mechanical and vibratory behavior of electronic and mechanical assemblies. They provide useful insights in a variety of situations:
Localization of hot spots
Identification of the stress concentration areas
Resonant frequencies calculation, modal analysis
We take into account multiphysical coupling, in particular the joint contribution of thermal and mechanical phenomena - for example, in the case of solder joints.
Our methodology is based on the 3 stages of the iteration cycle:
[Optional] Data collection
Measurement of actual material properties (CTE, Tg, Young's modulus, etc.)
Dimensional measurements and material identification (X-Ray CT, destructive analysis and SEM-EDS characterization)
Finite Element Modelling (FEM)
Thermal behaviour
Thermal mapping
Heat flux
Static analysis
Stress/strain mapping
Linear or non-linear
Dynamic analysis
Modal analysis, harmonic response, PSD
[Optional] Modelling vs Experimental correlation
Thermal mapping (IR camera)
Strain measurement under temperature
Do you want a detailed presentation of our Lab services or consult us about a specific need?