Digital simulation of thermal or thermo-mechanical performance of electronic assemblies provides useful insights on various application cases :

We perform these digital studies, by ourselves or with private experts (BLE), mostly on electronic modules and components. The main focus is on the assembly, either at component-level (die attach, flip-chip) or at board-level.

Thermal & thermo-mechanical simulation

3D Module : thermal mapping

Through-hole component : mechanical mapping (local stress)

BGA : damaging estimation (creep + plasticity) during thermal cycling

The representativity and relevancy of a digital simulation study heavily depends on its entry data, especially the design and material characteristics implemented into the FE model. We use our Material characterization and Technological analysis tools to access to these key inputs : geometry, material discrimination and properties (CTE, Tg, Young modulus…).