Digital simulation of thermal or thermo-mechanical performance of electronic assemblies provides useful insights on various application cases :
Evaluation of the consequences of a design or material change
Identification of the stress concentration areas
Comparison with an experimental thermal mapping
We perform these digital studies, by ourselves or with private experts (BLE), mostly on electronic modules and components. The main focus is on the assembly, either at component-level (die attach, flip-chip) or at board-level.
Thermal & thermo-mechanical simulation
3D Module : thermal mapping
Through-hole component : mechanical mapping (local stress)
BGA : damaging estimation (creep + plasticity) during thermal cycling
The representativity and relevancy of a digital simulation study heavily depends on its entry data, especially the design and material characteristics implemented into the FE model. We use our Material characterization and Technological analysis tools to access to these key inputs : geometry, material discrimination and properties (CTE, Tg, Young modulus…).