Checking the authenticity of components or the homogeneity within a batch is a major current challenge. Especially when you source them from new intermediaries or when they come from old batches.
The test protocol applied by ELEMCA aims to assess the conformity of the components tested with regard to their expected characteristics: external visual appearance of the package and terminations, dimensions and integrity of the chip, the bonds and the leadframe, electrical functions, wettability of the pins.
The results obtained are then compared with our database made up of observations on authentic components and on proven counterfeits.
The techniques implemented adapt to the level of sophistication of the suspected counterfeit and to the technology of the component.
Non destructive testing
These tests are carried out on all families of electronic components (active, discrete, passive), new or after long-term storage.
Standard tests: counterfeiting detection
Aim: point-out actual counterfeited parts
External visual inspection, marking
MIL-STD-883 Test Method 2009, SCC 24800
MIL-STD-883 Test Method 2012
Internal visual inspection after package opening
MIL-STD-883 Test Method 2010
External visual appearance: integrity of the package (marking: typography, punch) and terminations (absence of traces of flux or residual solder indicating a component unsoldered after first use)
Solvent or scalpel test: no sign of blacktopping
Non-destructive inspection of the elements inside the case: presence of the chip; chip and leadframe dimensions, position and geometry; integrity of interconnections (bondings): diameter, absence of breakage
Correspondence between the serial number of the chip and the one of the package. Comparison with our Components database; absence of anomaly on the chip (connection of bonds, alterations, tool marks, scratches, cracks, stains, traces of corrosion or contamination); passivation layer integrity
Advanced tests : Batch quality and homogeneity
Aim: evaluate the scattering amongst a batch (same date-code) or aging due to long-term storage
Acoustic microscopy (CSAM)
IPC/JEDEC J-STD-035, MIL-883 Method 2030.2
IEC-68-2-20 Test Ta Method 1
At room or high temperature
Absence of any critical defect: delamination or crack in the die attach or at the interface between the case and the leadframe / paddle
Observation of the solder wetting region; quality of wettability (good adhesion between the terminations and the solder)
Verification of the termination composition: absence of Lead for RoHS components
Confirmation of electrical characteristics: parametric I(V) or functional tests