Our thermal and climatic tests answer various needs: burni-in, qualification, reliability evaluation. We perform these tests on a wide range of products: electronic devices (components, circuit boards) and mechanical (metallic, composite parts).
We cover an environmental range compatible with most demanding applications :



Options : power supply / electrical monitoring; extra thermocouples, for in-situ thermal mapping


Steady temperature

Thermal cycling

HTSL (IEC 60068-2-2 ; IEC 60749-6 ; JESD22-A103C ; MIL-STD-883 Method 1008.2)
HTOL (JESD22-A108F ; IEC 60749-23 ; MIL-STD-883 Method 1005.10)

LTSL (IEC 60068-2-1 ; JESD22-A119)
LTOL (JESD22-A108F)

RTC (JESD22-A104F ; IEC 60068-2-14 ; MIL883 Method 1010.9)

Thermal + electrical cycling (JESD22-A105C)




Climatic

Thermal vacuum

Steady-state THB (IEC 60068-2-3 ; IEC 60749-5 ; JESD22-A101C)

Cycled THB (JESD22-A100C ; MIL-STD-883 Method 1004.7)

ECSS-Q-ST-70-17C



Applicable standards

IEC 60068-2 Environmental testing

IEC 60749 Semiconductor devices - Mechanical and climatic test Methods

JEDEC JESD22 Solid State Device Environmental Testing

MIL-STD-883K Test Method standard for microcircuits (version K, 04/16)