Our thermal and climatic tests meet your needs for burn-in, reliability assessment and qualification. They can be operated on a wide variety of products: electronic boards and components, mechanical parts and assemblies.

Firstly designed to simulate space environments (secondary vacuum, extended thermal ranges), our equipment covers a wide range of environmental conditions:

Thermal cycling

[-180°C ; +300°C] under dry nitrogen

Thermal shocks
[-80°C ; +220°C] double chamber

85% HR, 85°C

Vacuum thermal cycling
<5.10-6mbar, -180°C

Specific methods

  • SIR testing (Surface Insultation Resistance)
    • According to IPC-TM-650 or J-STD-004
  • Daisy chain testing
    • Periodic resistance increase measurements (IPC-9701)

Additional functionalities

  • Electrical biasing of the devices (max 1kV) and in-situ monitoring
  • Additional thermocouples to evaluate any thermal inhomogeneity

Steady temperature

Thermal cycling

HTSL (IEC 60068-2-2 ; IEC 60749-6 ; JESD22-A103C ; MIL-STD-883 Method 1008.2)
HTOL (JESD22-A108F ; IEC 60749-23 ; MIL-STD-883 Method 1005.10)

LTSL (IEC 60068-2-1 ; JESD22-A119)

Icing (Do-160 Section 24.0)

RTC (JESD22-A104F ; IEC 60068-2-14 ; MIL883 Method 1010.9)

Thermal + electrical cycling (JESD22-A105C)

Temperature & altitude (DO-160 Section 4.0)
Temperature variation (DO-160 Section 5.0)


Steady-state THB (IEC 60068-2-3 ; IEC 60749-5 ; JESD22-A101C)

Cycled THB (JESD22-A100C ; MIL-STD-883 Method 1004.7)

Humidity (DO-160 Section 6.0)

Thermal vacuum

Low pressure


IEC 60068-2-13 ; IEC 60068-2-39 ; MIL-STD-810 Method 500 ; MIL-STD-883 Method 505

Temperature & altitude (DO-160 Section 4.0)

Applicable standards

Test Method standard for microcircuits

Environmental Conditions and Test Procedures for Airborne Equipment

Solid State Device Environmental Testing

IEC 60749
Semiconductor devices - Mechanical and climatic test Methods

IEC 60068-2
Environmental testing

Do you want a detailed presentation of our Lab services or consult us about a specific need ?

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